Flip Chip Pin Grid Array - definição. O que é Flip Chip Pin Grid Array. Significado, conceito
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O que (quem) é Flip Chip Pin Grid Array - definição

TYPE OF INTEGRATED CIRCUIT PACKAGING. IN A PGA, THE PACKAGE IS SQUARE OR RECTANGULAR, AND THE PINS ARE ARRANGED IN A REGULAR ARRAY ON THE UNDERSIDE OF THE PACKAGE
SPGA; PPGA; FCPGA; Staggered pin grid array; Flip-chip pin grid array; Ceramic pin grid array; Plastic grid array; FC-PGA; Ceramic Pin Grid Array; Organic pin grid array; Opga; Organic Pin Grid Array; Pin Grid Array; Pin grid; OPGA; Stud grid array; Stud Grid Array; Polymer Stud Grid Array; Plastic Stud Grid Array; Staggered Pin Grid Array
  • Underside of an 80486 with lid removed shows die and wire bonded connections
  • AMD 754]])
  • Closeup of the pins of a pin grid array
  • AM2+ socket]]
  • View of the socket 7 321-pin connectors of a CPU
  • Underside of a [[Pentium 4]] in a PGA package
  • The underside of a FC-PGA package (the die is on the other side)
  • An example of a socket for a staggered pin grid array package
  • The topside of a [[Celeron]]-400 in a PPGA packing
  • The pin grid array at the bottom of a XC68020, a prototype of the [[Motorola 68020]] microprocessor

Flip Chip Pin Grid Array      
<hardware, processor> (FC-PGA) The package of certain Intel Celeron and Pentium III processors. FC-PGA processors fit into Socket 370 motherboard sockets. The Flip Chip Pin Grid Array is similar to PPGA, except that the silicon core is facing up and the heat slug is exposed. FC-PGA packaging is used by Pentium III processors, and Celeron 566 processors onward. Earlier Celeron processors used PPGA packaging. Celeron processors are also available in Slot 1 SEPP packaging and Pentium III processors in Slot 1 SECC2 packaging. Adapters are available to allow a PPGA Celeron to plug into a Slot 1 connector. (2000-08-26)
Pin Grid Array         
<hardware> (PGA) A style of integrated circuit socket or pin-out with pins laid out on a square or rectangular grid with a separation of 0.1 inch in each direction. The pins near the centre of the array are often missing. PGA is often used on motherboards for processors, e.g. Socket 6 and Socket 8. PPGA is "plastic PGA" (as opposed to ceramic?). See also SPGA. (2000-03-09)
Staggered Pin Grid Array         
<hardware> (SPGA) A style of integrated circuit socket or pin-out with a staggered grid of pins around the edge of the socket, positioned as several squares, one inside the other. SPGA is commonly used on motherboards for processors, e.g. Socket 5, Socket 7 and Socket 8. See also PGA. [Better description?] (1999-08-04)

Wikipédia

Pin grid array

A pin grid array (PGA) is a type of integrated circuit packaging. In a PGA, the package is square or rectangular, and the pins are arranged in a regular array on the underside of the package. The pins are commonly spaced 2.54 mm (0.1") apart, and may or may not cover the entire underside of the package.

PGAs are often mounted on printed circuit boards using the through hole method or inserted into a socket. PGAs allow for more pins per integrated circuit than older packages, such as dual in-line package (DIP).